一、基本情况

程娥，工学博士，硕士生导师，JMM、MICROFLUID NANOFLUID等国际期刊审稿专家。2015年3月在大连理工大学机械工程专业获得博士学位，2015年7月通过人才引进至机械工程学院工作至今。主要研究方向为柔性传感器，柔性机器人，微纳器件加工。主持和参与国家自然科学基金、河北省基金、河北省教育厅基金等多项课题，发表SCI论文20余篇。

二、近年来发表代表性论文情况（仅限第一作者或通讯作者），主编或参编的教材、专著情况，获得专利情况等

1. E Cheng, Zhansheng Zhang, Guangze Zhang, Lingxiao Gao, Xin Chen, Xiaoyang Bi. A triboelectric nanogenerator coupled with internal and external friction for gesture recognition based on EHD printing technology. Nano Energy, 2023,110, 108357.

2. Zhang Zhengyan, Fan Bu, E Cheng*, Haitao Liu*, Ning Hu*. Investigation of a novel approach for enhancing the sensitivity of flexible stretchable sensors by utilizing V-angle structures. Sensors and Actuators A-Physical，2022, 341, 113602.

3. E Cheng, Tianxiao Zhang, Yu Cheng, Jinnan Li, Zhengyan Zhang. High scaling ratio line width reduction and fabrication method with electrohydrodynamic jet printing, Micro & Nano Letters, 2021, 16(1), 23-29.

4. E Cheng, Ben Xing, Shanshan Li; Chengzhuang Yu, Junwei Li, Chunyang Wei, Cheng Cheng. Pressure-driven micro-casting for electrode fabrication and its applications in wear grain detections, Materials. 2019, 12(22), 3710.

5. Zhifu Yin, E Cheng, and Helin Zou. Fast Microfluidic Chip Fabrication Technique by Laser Erosion and Sticky Tape Assist Bonding Technique. 2018, 18, 4082–4086.

6. Zhifu Yin, E. Cheng, Helin Zou. Numerical study on the shrinkage behavior of SU8 patterns. 2017, 23(10), 4957–4964.

7. E Cheng, Zhifu Yin, Helin Zou, Li Chen. Surface modification-assisted bonding of 2D polymer-based nanofluidic devices. Microfluidics and Nanofluidics. 2015，10(3),527-535

8. E Cheng, Helin Zou, Zhifu Yin, Petr Jurčíček and Xi Zhang. Fabrication of 2D polymer nanochannels by sidewall lithography and hot embossing. Journal of Micromechanics and Microengineering, 2013, 23, 075022.

9. E Cheng, Helin Zou, Zhifu Yin and Petr Jurčíček. Experiment and numerical study on deformation behavior of polyethylene terephthalate two-dimensional nanochannels during hot embossing process. Journal of Micromechanics and Microengineering, 2014, 24, 015004.

三、联系方式：echeng@www.ndytng.com